Minneapolis, MN — The SMTA Technical Committee invites industry professionals to attend the 2011 International Conference on Soldering and Reliability being held this May 4-6, 2011 in Toronto, Ontario, Canada.

Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference brings together a community of soldering and reliability experts.

Suggested topics to be covered include:

Lead-free Assembly and Test

Reliability

Harsh Environment

Tin Whiskers

New Alloys

Electromigration

Thermal dissipation

Environmental Compliance/Regulations

Conformal Coating

Manufacturing Process

Package on Package

Advanced Packaging

Halogen-Free Laminates

High Density Interconnects

Thermal Interface Materials

Underfill

Printed Electronics

Die Attach Soldering & L-F Challenges

The conference is sponsored by the SMTA Toronto Chapter.